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TE Connectivity Passive Product HBS508M2JZ

HBS508M2JZ


  • Manufacturer: Maestro Wireless Solutions (Lantronix)
  • Chip 1 Group NO: HBS508M2JZ
  • Price: $12.70
  • Datasheet: PDF
  • Description: HBS508M2JZ(Kg)
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Details

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Parameters
Mfr TE Connectivity Passive Product
Series HBS, CGS
Package Bulk
Product Status Active
Resistance 8.2 MOhms
Tolerance ±5%
Power (Watts) 3W
Composition Thick Film
Features High Voltage, Non-Inductive
Temperature Coefficient ±100ppm/°C
Operating Temperature -55°C ~ 125°C
Package / Case Radial
Supplier Device Package Radial Lead
Size / Dimension 1.969" L x 0.039" W (50.00mm x 1.00mm)
Height - Seated (Max) 0.512" (13.00mm)
Number of Terminations 2
Failure Rate -
Base Product Number HBS5
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8533.21.0090
Standard Package 1,000
8.2 MOhms ±5% 3W Through Hole Resistor Radial High Voltage, Non-Inductive Thick Film