| Parameters |
| Mfr |
TE Connectivity AMP Connectors |
| Series |
Diplomate DL |
| Package |
Tray |
| Product Status |
Obsolete |
| Type |
SIP |
| Number of Positions or Pins (Grid) |
18 (1 x 18) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Tin |
| Contact Finish Thickness - Mating |
- |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Closed Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
- |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Thermoplastic, Glass Filled |
| Operating Temperature |
-55°C ~ 105°C |
| Termination Post Length |
0.130" (3.30mm) |
| Material Flammability Rating |
UL94 V-0 |
| Contact Resistance |
- |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
Vendor Undefined |
| ECCN |
EAR99 |
| HTSUS |
8536.69.4040 |
| Standard Package |
480 |
18 (1 x 18) Pos SIP Socket Tin Through Hole