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TDK Corporation CC45SL3FD180JYGNA

CC45SL3FD180JYGNA


  • Manufacturer: Hoffman Enclosures, Inc.
  • Chip 1 Group NO: CC45SL3FD180JYGNA
  • Price: $0.40
  • Datasheet: PDF
  • Description: CC45SL3FD180JYGNA(Kg)
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Details

Tags

Parameters
Applications General Purpose
Failure Rate -
Mounting Type Through Hole
Package / Case Radial, Disc
Size / Dimension 0.217" Dia (5.50mm)
Height - Seated (Max) 0.374" (9.50mm)
Thickness (Max) -
Lead Spacing 0.295" (7.50mm)
Lead Style Formed Leads - Kinked
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8532.24.0060
Standard Package 1,000
Mfr TDK Corporation
Series CC45
Package Bulk
Product Status Active
Capacitance 18 pF
Tolerance ±5%
Voltage - Rated 3000V (3kV)
Temperature Coefficient SL
Operating Temperature -25°C ~ 125°C
Features High Voltage, Low Dissipation Factor
Ratings -
18 pF ±5% 3000V (3kV) Ceramic Capacitor SL Radial, Disc