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Amphenol ICC (FCI) SIP1X14-011BLF

SIP1X14-011BLF


  • Manufacturer: Super micro Computer, Inc
  • Chip 1 Group NO: SIP1X14-011BLF
  • Price:
  • Datasheet: PDF
  • Description: SIP1X14-011BLF(Kg)
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Details

Tags

Parameters
Mfr Amphenol ICC (FCI)
Series SIP1x
Package Bulk
Product Status Obsolete
Type SIP
Number of Positions or Pins (Grid) 14 (1 x 14)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Brass
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -
Termination Post Length 0.125" (3.18mm)
Material Flammability Rating UL94 V-0
Contact Resistance -
Base Product Number SIP1X14
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 700
14 (1 x 14) Pos SIP Socket Gold Through Hole