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Amphenol ICC (FCI) SIP1X14-011BLF
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| Parameters | |
|---|---|
| Mfr | Amphenol ICC (FCI) |
| Series | SIP1x |
| Package | Bulk |
| Product Status | Obsolete |
| Type | SIP |
| Number of Positions or Pins (Grid) | 14 (1 x 14) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | - |
| Termination Post Length | 0.125" (3.18mm) |
| Material Flammability Rating | UL94 V-0 |
| Contact Resistance | - |
| Base Product Number | SIP1X14 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Standard Package | 700 |
14 (1 x 14) Pos SIP Socket Gold Through Hole
