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Amphenol ICC (FCI) SIP050-1X32-157BLF

SIP050-1X32-157BLF


  • Manufacturer: Super micro Computer, Inc
  • Chip 1 Group NO: SIP050-1X32-157BLF
  • Price:
  • Datasheet: PDF
  • Description: SIP050-1X32-157BLF(Kg)
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Details

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Parameters
Mfr Amphenol ICC (FCI)
Series SIP050-1x
Package Bulk
Product Status Obsolete
Type SIP
Number of Positions or Pins (Grid) 32 (1 x 32)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 200.0µin (5.08µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Brass
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -
Termination Post Length 0.095" (2.41mm)
Material Flammability Rating UL94 V-0
Contact Resistance -
Base Product Number SIP050
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 400
32 (1 x 32) Pos SIP Socket Tin Through Hole