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Amphenol ICC (FCI) DIP324-001BLF

DIP324-001BLF


  • Manufacturer: Super micro Computer, Inc
  • Chip 1 Group NO: DIP324-001BLF
  • Price:
  • Datasheet: PDF
  • Description: DIP324-001BLF(Kg)
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Details

Tags

Parameters
Termination Post Length 0.125" (3.18mm)
Material Flammability Rating UL94 V-0
Contact Resistance -
Base Product Number DIP324
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1,836
Mfr Amphenol ICC (FCI)
Series -
Package Bag
Product Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Brass
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -
24 (2 x 12) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole