| Parameters |
| Mfr |
Advanced Thermal Solutions Inc. |
| Series |
dualFLOW™ |
| Package |
Box |
| Product Status |
Active |
| Type |
Top Mount, Zipper Fin |
| Package Cooled |
Intel LGA2011 & LGA2066 CPU Cooler |
| Attachment Method |
Push Pin |
| Shape |
Square, Fins |
| Length |
3.637" (92.38mm) |
| Width |
3.626" (92.11mm) |
| Diameter |
- |
| Fin Height |
1.142" (29.00mm) |
| Power Dissipation @ Temperature Rise |
- |
| Thermal Resistance @ Forced Air Flow |
- |
| Thermal Resistance @ Natural |
- |
| Material |
Copper |
| Material Finish |
Nickel |
| Base Product Number |
ATS-UC |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8473.30.5100 |
| Standard Package |
5 |
Heat Sink Intel LGA2011 & LGA2066 CPU Cooler Copper Top Mount, Zipper Fin