|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Linear Devices Inc. |
TL16C550BN
|
|
40-DIP (0.600", 15.24mm) |
|
|
|
|
NetBurner Inc. |
ISD4004-12MPY
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
Axiomtek |
XR16V564IVTR-F
|
|
64-LQFP |
|
|
|
|
Axiomtek |
XR68C92J-F
|
|
|
|
|
|
|
NetBurner Inc. |
ISD1416SI
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
NetBurner Inc. |
ISD4002-150EIR
|
|
28-TSSOP (0.465", 11.80mm Width) |
|
|
|
|
NetBurner Inc. |
ISD5216P
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
NetBurner Inc. |
ISD1740EYR
|
|
28-TSSOP (0.465", 11.80mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2155L
|
|
100-LQFP |
|
|
|
|
NetBurner Inc. |
ISD91361VRI
|
|
|
|
|
|
|
Axiomtek |
ST16C580CQ48TR-F
|
|
48-TQFP |
|
|
|
|
FinishAdapt Limited |
PSB 6970 HL V1.3
|
|
100-LQFP Exposed Pad |
|
|
|
|
Axiomtek |
XR16L651IM-F
|
|
48-TQFP |
|
|
|
|
Z-World |
BCM56072A0KFSBG
|
|
896-BFBGA, FCBGA |
|
|
|
|
IXYS Integrated Circuits Division |
73M1866B-IMR/F
|
|
42-VFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
CPC7581MC
|
|
16-VDFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
M-984-02P
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
NetBurner Inc. |
ISD1610BSYIR
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2156L+
|
|
100-LQFP |
|
|
|
|
Axiomtek |
XR16M890IM48-F
|
|
48-TQFP |
|
|
|
|
Axiomtek |
XR16M554IV80TR-F
|
|
80-LQFP |
|
|
|
|
IXYS Integrated Circuits Division |
DS2172T+TR
|
|
32-TQFP |
|
|
|
|
Z-World |
BCM56626B2IFSBLG
|
|
|
|
|
|
|
ON SEMICONDUCTOR |
TDA18264HB/C1
|
|
80-TFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
CPC7581MB
|
|
16-VDFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HC3-5504-5X154
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
89HPES6T5ZBBCGI
|
|
196-BGA |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
89H12NT12G2ZBHL
|
|
324-BBGA, FCBGA |
|
|
|
|
FinishAdapt Limited |
PEF22624EV1.3-G
|
|
324-LBGA |
|
|
|
|
Laird - Wireless & Thermal Systems |
TS190PTR
|
|
8-SMD, Gull Wing |
|
|
|
