|
Part Number |
|
|
|
|
Details |
|
|
|
Transphorm |
PI3PCIE3442AZHE
|
|
42-VFQFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
89HT0808PYDABG
|
|
100-LFBGA |
|
|
|
|
Laird - Wireless & Thermal Systems |
CPC5620ATR
|
|
32-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Z-World |
BCM5397KPBGG
|
|
- |
|
|
|
|
Z-World |
BCM5714CKPB
|
|
484-BGA |
|
|
|
|
Z-World |
BCM5714CKPBGG
|
|
484-BGA |
|
|
|
|
Transphorm |
PI7C9X2G1616PRAHSBE
|
|
- |
|
|
|
|
Transphorm |
PI3DBS12612ZTFE
|
|
|
|
|
|
|
Transphorm |
PI7C9X2G404ELQZXAEX
|
|
136-VFQFN Dual Rows, Exposed Pad |
|
|
|
|
Micross Components |
UFE412-M4
|
|
676-BBGA, FCBGA |
|
|
|
|
MaxLinear, Inc. |
SI32178-B-FM1R
|
|
42-WFQFN Exposed Pad |
|
|
|
|
Transphorm |
PI7C9X2G912GPANJE
|
|
|
|
|
|
|
Transphorm |
PI3PCIE3442AZLE
|
|
40-WFQFN Exposed Pad |
|
|
|
|
Transphorm |
PI7C9X2G912GPANJEX
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
PEF82902F
|
|
64-LQFP |
|
|
|
|
Laird - Wireless & Thermal Systems |
CYG2111
|
|
18-DIP Module (0.850", 21.59mm), 9 Leads |
|
|
|
|
Abracon |
CMX683D4
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
UCC5343M
|
|
|
|
|
|
|
Micross Components |
PM5369-FXI
|
|
672-BBGA, FCBGA |
|
|
|
|
Micross Components |
PM8393-PGI
|
|
- |
|
|
|
|
Micross Components |
UFE412-T1
|
|
676-BBGA, FCBGA |
|
|
|
|
FinishAdapt Limited |
PEB7274HV1.2
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL5585BIMZ-T
|
|
28-LCC (J-Lead) |
|
|
|
|
MaxLinear, Inc. |
SI32287-A-GMR
|
|
56-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
ZL50020GAG2
|
|
256-BGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3107ETG/V+T
|
|
24-WFQFN Exposed Pad |
|
|
|
|
MaxLinear, Inc. |
SI32184-A-FM
|
|
40-VFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
PSB8430ZDW
|
|
|
|
|
|
|
MaxLinear, Inc. |
SI32171-C-GM1R
|
|
42-WFQFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HC5515IP
|
|
22-DIP (0.400", 10.16mm) |
|
|
|
