|
Part Number |
|
|
|
|
Details |
|
|
|
Micross Components |
PIC24FJ256DA110-I/BG
|
|
121-TFBGA |
|
|
|
|
Micross Components |
PIC18LF24K42-E/SO
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
API Delevan Inc. |
XCS40XL-4BG256I
|
|
256-BBGA |
|
|
|
|
Samtec Inc. |
ADBF504WYCPZ401
|
|
88-VFQFN Exposed Pad, CSP |
|
|
|
|
API Delevan Inc. |
XCS40XL-4PQ208C
|
|
208-BFQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
5AGXMA1D6F31C6G
|
|
896-BBGA, FCBGA |
|
|
|
|
API Delevan Inc. |
XCS40XL-5BG256C
|
|
256-BBGA |
|
|
|
|
Samtec Inc. |
ADUC7023BCBZ62I-R7
|
|
36-UFBGA, WLCSP |
|
|
|
|
NetBurner Inc. |
NANO110KE3BN
|
|
128-LQFP |
|
|
|
|
BeagleBoard.org |
EP610DM-30
|
|
24-CDIP |
|
|
|
|
TE Connectivity / Corcom |
EPM1270GF256C4
|
|
256-BGA |
|
|
|
|
TE Connectivity / Corcom |
EPM1270GT144C5
|
|
144-LQFP |
|
|
|
|
Micross Components |
PIC16C711-04I/SS
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Micross Components |
PIC24FJ128GA705-I/PT
|
|
48-TQFP |
|
|
|
|
Advanced Linear Devices Inc. |
F280038CPMQ1
|
|
64-LQFP |
|
|
|
|
Micross Components |
PIC24F32KA302-E/SS
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
API Delevan Inc. |
XCS40XL-5PQ208C
|
|
208-BFQFP |
|
|
|
|
TE Connectivity / Corcom |
EPM570T100C3
|
|
100-TQFP |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F51306BDFL#30
|
|
48-LQFP |
|
|
|
|
Samtec Inc. |
ADBF592WYCPZ402
|
|
64-VFQFN Exposed Pad, CSP |
|
|
|
|
API Delevan Inc. |
XCV100-4BG256I
|
|
256-BBGA |
|
|
|
|
Samtec Inc. |
ADBF531WYBCZ406
|
|
160-LFBGA, CSPBGA |
|
|
|
|
Micross Components |
PIC16LF15376-E/PT
|
|
44-TQFP |
|
|
|
|
Brady Corporation |
STM32L051K8T6
|
|
32-LQFP |
|
|
|
|
Micross Components |
PIC18F24K42-E/SO
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
American Technical Ceramics |
LAE3-35EA-6LFN484E
|
|
484-BBGA |
|
|
|
|
API Delevan Inc. |
XC3S200-4FT256C
|
|
256-LBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
5CGXFC7B6M15C7N
|
|
484-LFBGA |
|
|
|
|
American Technical Ceramics |
M4A3-32/32-7JC
|
|
44-LCC (J-Lead) |
|
|
|
|
Advanced Thermal Solutions Inc. |
EP3C55F484C7
|
|
484-BGA |
|
|
|
