|
Part Number |
|
|
|
|
Details |
|
|
|
TE Connectivity / Corcom |
EPM570GT144C5
|
|
144-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
EP4CGX75CF23I7
|
|
484-BGA |
|
|
|
|
Micross Components |
M1A3P600-1FGG484
|
|
484-BGA |
|
|
|
|
API Delevan Inc. |
XCS30XL-4VQ100C
|
|
100-TQFP |
|
|
|
|
Micross Components |
ATTINY461-20SUR
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Samtec Inc. |
AD21477WYCPZ1A02
|
|
88-VFQFN Exposed Pad, CSP |
|
|
|
|
Advanced Thermal Solutions Inc. |
10CX220YU484I5G
|
|
484-BFBGA |
|
|
|
|
Micross Components |
PIC16F1708-I/P
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R7FS124763A01CFM#AA1
|
|
64-LQFP |
|
|
|
|
Micross Components |
PIC18F4321T-I/PT
|
|
44-TQFP |
|
|
|
|
API Delevan Inc. |
XCS30XL-5PQ208C
|
|
208-BFQFP |
|
|
|
|
Brady Corporation |
STM8S103F2M6
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
API Delevan Inc. |
XCS30XL-5PQ240C
|
|
240-BFQFP |
|
|
|
|
Brady Corporation |
STM32F446RCT6TR
|
|
64-LQFP |
|
|
|
|
Micross Components |
PIC16C620A-04I/P
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
AD21478WYSWZ2B02
|
|
100-LQFP Exposed Pad |
|
|
|
|
Micross Components |
A3P600-1FG484
|
|
484-BGA |
|
|
|
|
API Delevan Inc. |
XCS30XL-5TQ144C
|
|
144-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
5CGXBC7B6M15C7N
|
|
484-LFBGA |
|
|
|
|
Brady Corporation |
STM32F446MEY6TR
|
|
81-UFBGA, WLCSP |
|
|
|
|
API Delevan Inc. |
XCS30XL-5VQ100C
|
|
100-TQFP |
|
|
|
|
Brady Corporation |
STM32F302RET6TR
|
|
64-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
5CEFA7F23C6N
|
|
484-BGA |
|
|
|
|
Micross Components |
PIC16F1768-I/ML
|
|
20-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADBF533WBBCZ506
|
|
160-LFBGA, CSPBGA |
|
|
|
|
TE Connectivity / Corcom |
EPM240GT100C5
|
|
100-TQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
10CX220YF672I6G
|
|
672-BBGA, FCBGA |
|
|
|
|
TE Connectivity / Corcom |
EPM570GT100C4
|
|
100-TQFP |
|
|
|
|
TE Connectivity / Corcom |
EPM1270GT144C3
|
|
144-LQFP |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F101GDAFB#30
|
|
48-LQFP |
|
|
|
