|
Part Number |
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|
Details |
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|
Wandboard.Org |
74LVC1G66GM,132
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|
6-XFDFN |
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IXYS Integrated Circuits Division |
MAX489ESD
|
|
14-SOIC (0.154", 3.90mm Width) |
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|
ON SEMICONDUCTOR |
TJA1050T/CM,118
|
|
8-SOIC (0.154", 3.90mm Width) |
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Transphorm |
PI3DPX1203ZHE
|
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42-VFQFN Exposed Pad |
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FinishAdapt Limited |
PBL38112/1QSA
|
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ebm-papst Inc. |
HIN209CP
|
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24-DIP (0.300", 7.62mm) |
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Advanced Linear Devices Inc. |
TCA6416PWT
|
|
24-TSSOP (0.173", 4.40mm Width) |
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Transphorm |
PI3EQXDP1201ZBE
|
|
48-VFQFN Exposed Pad |
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|
IXYS Integrated Circuits Division |
MAX3097EEEE
|
|
16-SSOP (0.154", 3.90mm Width) |
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|
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|
ebm-papst Inc. |
HIN206CP
|
|
24-DIP (0.300", 7.62mm) |
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|
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|
IXYS Integrated Circuits Division |
DG406DN+T
|
|
28-LCC (J-Lead) |
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|
Quatech-Division of B&B Electronics |
HC55130IB
|
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28-SOIC (0.295", 7.50mm Width) |
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Transphorm |
PI3EQX8904ZHE
|
|
42-VFQFN Exposed Pad |
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Alpha & Omega Semiconductor Inc. |
HIN232ECPZ
|
|
16-DIP (0.300", 7.62mm) |
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|
Samtec Inc. |
MUX08FSZ
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
Advanced Linear Devices Inc. |
DP83815DVNG/NOPB
|
|
144-LQFP |
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|
IXYS Integrated Circuits Division |
MAX394EAP+
|
|
20-SSOP (0.209", 5.30mm Width) |
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Transphorm |
PI2EQX8814AFNJE
|
|
100-LBGA |
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Transphorm |
PI3EQX5701ZDE
|
|
20-WFQFN Exposed Pad |
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|
IXYS Integrated Circuits Division |
MAX333AEPP+
|
|
20-DIP (0.300", 7.62mm) |
|
|
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|
ebm-papst Inc. |
HC3-5504B-5R2489
|
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|
Advanced Linear Devices Inc. |
PCA9534DW
|
|
16-SOIC (0.295", 7.50mm Width) |
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|
|
|
Micross Components |
LAN91C96I-MS
|
|
100-BQFP |
|
|
|
|
FinishAdapt Limited |
CYPD3178-24LQXQT
|
|
24-UFQFN Exposed Pad |
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|
|
|
Advanced Linear Devices Inc. |
TCA6416RTWT
|
|
24-WFQFN Exposed Pad |
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|
|
|
Transphorm |
AP43771VFBZ-13
|
|
14-WFDFN Exposed Pad |
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Transphorm |
PI3EQX8984ZLE
|
|
72-WFQFN Exposed Pad |
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Micross Components |
HV2918/R4X
|
|
64-VFQFN Exposed Pad |
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Transphorm |
PI2EQX5984ZLE
|
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72-WFQFN Exposed Pad |
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ebm-papst Inc. |
HC5515CP
|
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22-DIP (0.400", 10.16mm) |
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