|
Part Number |
|
|
|
|
Details |
|
|
|
ebm-papst Inc. |
HC55171BIB
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Transphorm |
PI3EQX10904ZHE
|
|
42-VFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
PCF8575CDGVR
|
|
24-TFSOP (0.173", 4.40mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TCA6416RTWR
|
|
24-WFQFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HI3-0509A-5Z
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
HIN239IP
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
COM20020I-DZD-TR
|
|
28-LCC (J-Lead) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LC709004AMJ-AH
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
DG212CY+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3238EEAI
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Micross Components |
LAN9730-ABZJ
|
|
56-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADG5408TCPZ-EP-RL7
|
|
16-WQFN Exposed Pad, CSP |
|
|
|
|
Quatech-Division of B&B Electronics |
HC3-5502B-5
|
|
24-DIP (0.600", 15.24mm) |
|
|
|
|
Advanced Linear Devices Inc. |
DSLVDS1047PWR
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
ebm-papst Inc. |
HC4P5502B-5X96
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL3171EIBZ-T7A
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI3EQX5701ZDEX
|
|
20-WFQFN Exposed Pad |
|
|
|
|
Micross Components |
LAN8741AI-EN-TR
|
|
32-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG411CJ+
|
|
|
|
|
|
|
ON SEMICONDUCTOR |
PCA9539RPW,118
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DG407EWI+T
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Transphorm |
PI2EQX8814ANJEX
|
|
100-LBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3098EBCPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
HC3-5502BB4086-003
|
|
|
|
|
|
|
Transphorm |
PI2EQX8864AZLEX
|
|
72-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX307EWI+
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TCA6416PW
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Transphorm |
PI2EQXDP101-AZFEX
|
|
36-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3097ECPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
HIN209CB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
