|
Part Number |
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|
Details |
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American Technical Ceramics |
ISPGAL22LV10-4LK
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28-SSOP (0.209", 5.30mm Width) |
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American Technical Ceramics |
ISPGAL22V10C-15LK
|
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28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Advanced Thermal Solutions Inc. |
10M16DAF256A7G
|
|
256-LBGA |
|
|
|
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Micross Components |
A3P1000-FGG484
|
|
484-BGA |
|
|
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Micross Components |
PIC10F320T-I/OT
|
|
SOT-23-6 |
|
|
|
|
Micross Components |
PIC12F1571T-I/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
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|
American Technical Ceramics |
ISPLSI 1016-90LJ
|
|
44-LCC (J-Lead) |
|
|
|
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American Technical Ceramics |
GAL26V12C-10LJ
|
|
28-LCC (J-Lead) |
|
|
|
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Advanced Thermal Solutions Inc. |
10M16DAF484I7G
|
|
484-BGA |
|
|
|
|
Rittal |
MM908E626AVPEK
|
|
54-SSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
Micross Components |
ATTINY404-SSNR
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
American Technical Ceramics |
GAL26V12C-20LJ
|
|
28-LCC (J-Lead) |
|
|
|
|
API Delevan Inc. |
XC6SLX150T-3CSG484C
|
|
484-FBGA, CSPBGA |
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|
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American Technical Ceramics |
LFCPNX-100-7BFG484C
|
|
484-BBGA |
|
|
|
|
American Technical Ceramics |
GAL26V12C-7LJ
|
|
28-LCC (J-Lead) |
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|
|
|
TE Connectivity / Corcom |
EPF8820ARC208-4
|
|
208-BFQFP Exposed Pad |
|
|
|
|
API Delevan Inc. |
XC3S5000-4FG676I
|
|
676-BGA |
|
|
|
|
American Technical Ceramics |
OR2T40A7PS208-DB
|
|
208-BFQFP Exposed Pad |
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|
|
|
American Technical Ceramics |
ISPLSI 1016-110LJ
|
|
44-LCC (J-Lead) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F10Y47ASP#50
|
|
16-SSOP (0.173", 4.40mm Width) |
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|
|
|
American Technical Ceramics |
ISPLSI 1016-60LJ
|
|
44-LCC (J-Lead) |
|
|
|
|
API Delevan Inc. |
XC6SLX100T-3FG484I
|
|
484-BBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
39STB05500PBA08C
|
|
|
|
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Sunon Fans |
37C665CLVTQFP
|
|
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|
|
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American Technical Ceramics |
ISPLSI 1016-80LJ
|
|
44-LCC (J-Lead) |
|
|
|
|
American Technical Ceramics |
ISPLSI 1016E-125LJN
|
|
44-LCC (J-Lead) |
|
|
|
|
American Technical Ceramics |
ISPLSI 1016E-80LJN
|
|
44-LCC (J-Lead) |
|
|
|
|
Advanced Thermal Solutions Inc. |
10CL055YU484A7G
|
|
484-FBGA |
|
|
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|
American Technical Ceramics |
ISPLSI 1016E-80LJNI
|
|
44-LCC (J-Lead) |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
39STB04501PBB05C
|
|
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