|
Part Number |
|
|
|
|
Details |
|
|
|
Micross Components |
M2GL150-FC1152I
|
|
1152-BBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA1F672C2ES
|
|
672-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EP4CE22F17C6N
|
|
256-LBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
39ST305301PBA08C
|
|
|
|
|
|
|
Micross Components |
M2GL150TS-FCVG484
|
|
484-BFBGA |
|
|
|
|
Micross Components |
A42MX24-PQG160
|
|
160-BQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
10M40DCF256C8G
|
|
256-LBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
5CEFA2F23C6N
|
|
484-BGA |
|
|
|
|
Sunon Fans |
91C100QFP
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA10F1020C1ES
|
|
1020-BBGA |
|
|
|
|
American Technical Ceramics |
LFX200EB-03F516I
|
|
256-BGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA1F484C2
|
|
484-BBGA |
|
|
|
|
American Technical Ceramics |
GAL22V10D-4LJ
|
|
28-LCC (J-Lead) |
|
|
|
|
Micross Components |
APA300-BGG456I
|
|
456-BBGA |
|
|
|
|
TE Connectivity / Corcom |
EP20K100EFC144-2X
|
|
144-BGA |
|
|
|
|
TE Connectivity / Corcom |
EPF10K30BC356-4
|
|
356-LBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA1F484I2
|
|
484-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA1F672C1ES
|
|
672-BBGA |
|
|
|
|
Sunon Fans |
FDC765ALJTMCB
|
|
|
|
|
|
|
American Technical Ceramics |
GAL26CV12B-15LJ
|
|
28-LCC (J-Lead) |
|
|
|
|
Micross Components |
AFS600-1FG484I
|
|
484-BGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA4F1020C1
|
|
1020-BBGA |
|
|
|
|
ON SEMICONDUCTOR |
MC68EN360AI33L557
|
|
|
|
|
|
|
American Technical Ceramics |
GAL26CV12C-7LJ
|
|
28-LCC (J-Lead) |
|
|
|
|
Micross Components |
M2GL150T-FCSG536
|
|
536-LFBGA, CSPBGA |
|
|
|
|
American Technical Ceramics |
GAL22V10D-25LPN
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Thermal Solutions Inc. |
EPXA4F672C1
|
|
672-BBGA |
|
|
|
|
American Technical Ceramics |
GAL22V10D-25QJ
|
|
28-LCC (J-Lead) |
|
|
|
|
Micross Components |
APA300-FGG144A
|
|
144-LBGA |
|
|
|
|
API Delevan Inc. |
XC7A200T-L2FBG676E
|
|
676-BBGA, FCBGA |
|
|
|
