|
Part Number |
|
|
|
|
Details |
|
|
|
Micross Components |
AT93C66-10SC
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
NJR Corporation/NJRC |
TE28F160C3BD70A
|
|
48-TFSOP (0.724", 18.40mm Width) |
|
|
|
|
Advanced Thermal Solutions Inc. |
MD51C68-70/B
|
|
|
|
|
|
|
Micross Components |
AT93C66-10TI-1.8
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
BI Technologies |
CAT25010VI-G
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
3201L2833
|
|
|
|
|
|
|
BI Technologies |
CAT93C66YGI-T3
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
2547P1088
|
|
|
|
|
|
|
Advantech |
71V3577S75BQ
|
|
165-TBGA |
|
|
|
|
Advantech |
71V67703S80PFGI
|
|
100-LQFP |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
3246L1075-1
|
|
|
|
|
|
|
Micross Components |
AT93C57-10SI-2.7
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
BI Technologies |
CAT93C66YGI
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
AT93C57W-10SC-2.5
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advantech |
71V424L12YG
|
|
36-BSOJ (0.400", 10.16mm Width) |
|
|
|
|
Micross Components |
AT93C57W-10SI
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advantech |
71256SA12PZG
|
|
28-TSSOP (0.465", 11.80mm Width) |
|
|
|
|
Micross Components |
AT93C57W-10SI-2.5
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
BI Technologies |
CAT24AA02WGI
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Excelitas Technologies |
LH28F640SPHT-PTL12
|
|
56-TFSOP (0.724", 18.40mm Width) |
|
|
|
|
Advantech |
71V016SA12PHGI
|
|
44-TSOP (0.400", 10.16mm Width) |
|
|
|
|
BI Technologies |
CAT24C05TDGI-T3
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
VersaLogic |
CG5195AF
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R1LV3216RSD-7SI#B0
|
|
52-TFSOP (0.350", 8.89mm Width) |
|
|
|
|
BI Technologies |
CAT64LC40VGI
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Aim Dynamics |
S29GL256S10DHV013
|
|
64-LBGA |
|
|
|
|
Micross Components |
AT93C66-10TI-2.7
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
AT93C66W-10SI-1.8
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
3247P0590
|
|
|
|
|
|
|
Micross Components |
AT93C86-10PC-2.7
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
