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Memory

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Micross Components
AT93C46W-10SI-1.8
8-SOIC (0.154", 3.90mm Width)
Advantech
71V321L35JGI
52-LCC (J-Lead)
NMB Technologies Corporation
AM29F016D-150E4C
40-TFSOP (0.724", 18.40mm Width)
BI Technologies
CAT24C128WGI
8-SOIC (0.154", 3.90mm Width)
Micross Components
AT93C56-10PI-1.8
8-DIP (0.300", 7.62mm)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT00000021L0597
BI Technologies
CAT28LV64G20
32-LCC (J-Lead)
VersaLogic
CG5847ATT
Advantech
71016S20PHG
44-TSOP (0.400", 10.16mm Width)
Advantech
71256L25YG
28-BSOJ (0.300", 7.62mm Width)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT0000001L3335
Micross Components
AT93C56W-10SI-1.8
8-SOIC (0.154", 3.90mm Width)
VersaLogic
CG6252AAT
Advantech
71V35761SA166BGG
119-BGA
Micross Components
AT93C57-10PC-1.8
8-DIP (0.300", 7.62mm)
Micross Components
AT93C57-10PC-2.5
8-DIP (0.300", 7.62mm)
Panasonic - DTG
AT28C256E-15FM883
28-CFlatPack
Micross Components
AT93C57-10PC-2.7
8-DIP (0.300", 7.62mm)
Micross Components
AT93C57-10PI
8-DIP (0.300", 7.62mm)
Advantech
71V67603S133PFG
100-LQFP
Aim Dynamics
S29GL128P11TFIV13
56-TFSOP (0.724", 18.40mm Width)
BI Technologies
CAT28LV64H1325
28-TSSOP (0.465", 11.80mm Width)
Micross Components
AT93C57-10PI-1.8
8-DIP (0.300", 7.62mm)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT57P7090
Panasonic - DTG
AT24CS04-SSHM-B
8-SOIC (0.154", 3.90mm Width)
Advantech
7164S55DB
28-CDIP (0.600", 15.24mm)
VersaLogic
CY7C1041BN-15ZXIT
44-TSOP (0.400", 10.16mm Width)
Micross Components
AT93C57-10SC-2.5
8-SOIC (0.154", 3.90mm Width)
BI Technologies
CAT24C64ZGI
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
BI Technologies
CAT24C256ZD2GI-T2
8-WFDFN Exposed Pad