|
Part Number |
|
|
|
|
Details |
|
|
|
Inphi Corporation |
TN5D51A-HB11-E
|
|
TO-220-5 Full Pack, Formed Leads |
|
|
|
|
Samtec Inc. |
LTC3525ISC6-3.3#TRMPBF
|
|
6-TSSOP, SC-88, SOT-363 |
|
|
|
|
IXYS Integrated Circuits Division |
MAX20406AFOC/VY+
|
|
17-PowerWFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX20406AFOD/VY+
|
|
17-PowerWFQFN |
|
|
|
|
Advanced Linear Devices Inc. |
LM20133MH/NOPB
|
|
16-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX25239AFFB/VY+
|
|
22-PowerWFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX20406AFOA/VY+
|
|
17-PowerWFQFN |
|
|
|
|
Samtec Inc. |
LT3582EUD-5#TRPBF
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Inphi Corporation |
TN5D61A-HB11-E
|
|
TO-220-6 Full Pack, Formed Leads |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1763EUE-TG068
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
LM5576QMHX/NOPB
|
|
20-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1734EUK15
|
|
SC-74A, SOT-753 |
|
|
|
|
FinishAdapt Limited |
TDM3883XUMA1
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
LM2598S-12/NOPB
|
|
TO-263-8, D²Pak (7 Leads + Tab), TO-263CA |
|
|
|
|
Advanced Linear Devices Inc. |
LM2593HVSX-5.0/NOPB
|
|
TO-263-8, D²Pak (7 Leads + Tab), TO-263CA |
|
|
|
|
Terasic Inc. |
RP604K501A-TR
|
|
12-UFDFN Exposed Pad |
|
|
|
|
Raltron Electronics |
MPQ4317GRE-5-AEC1-P
|
|
20-PowerVFQFN |
|
|
|
|
Terasic Inc. |
R1245K003G-TR
|
|
8-UFDFN Exposed Pad |
|
|
|
|
BURR-BROWN CORP |
LM2575S-3.3
|
|
TO-263-6, D²Pak (5 Leads + Tab), TO-263BA |
|
|
|
|
Micross Components |
MIC4574YN
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Linear Devices Inc. |
TPS61093QDSKRQ1
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
R1283K001A-TR
|
|
12-UFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
R1283K001B-TR
|
|
12-UFDFN Exposed Pad |
|
|
|
|
BURR-BROWN CORP |
LM2594HVM-12
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Brady Corporation |
L4978D
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
LM2671N-ADJ/NOPB
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
BURR-BROWN CORP |
LM2594HVM-5.0
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Terasic Inc. |
RP604Z501B-E2-F
|
|
20-XFBGA, WLCSP |
|
|
|
|
Terasic Inc. |
RP602Z330C-E2-F
|
|
20-UFBGA, WLCSP |
|
|
|
|
Advanced Linear Devices Inc. |
SM72485SD/NOPB
|
|
8-WDFN Exposed Pad |
|
|
|
