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Part Number |
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Details |
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IXYS Integrated Circuits Division |
MAX868EUB+T
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|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
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|
Walsin Technology Corporation |
SIC462ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
Raltron Electronics |
MP2147GD-Z
|
|
12-PowerVFQFN |
|
|
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|
Samtec Inc. |
LT8606IMSE#TRPBF
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3464ETS8#TRPBF
|
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SOT-23-8 Thin, TSOT-23-8 |
|
|
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Micross Components |
TC7662BEOA713
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Raltron Electronics |
MP4470AGL-Z
|
|
20-VFQFN Exposed Pad |
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|
|
|
IXYS Integrated Circuits Division |
MAX17542GATB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADP5073ACPZ-R7
|
|
16-WFQFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1722EZK+T
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17501FATB+T
|
|
10-WFDFN Exposed Pad |
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|
|
|
IXYS Integrated Circuits Division |
MAX1724EZK50+T
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
Micross Components |
TC7662BEOA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17501GATB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3494AEDDB#TRPBF
|
|
8-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1724EZK33+T
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
Samtec Inc. |
ADP2503ACPZ-3.3-R7
|
|
10-VFDFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8560EZK+T
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
Walsin Technology Corporation |
SIC467ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
Walsin Technology Corporation |
SIC461ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5035DUSA+T
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Walsin Technology Corporation |
SIC453ED-T1-GE3
|
|
34-PowerWFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17501EATB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADP2370ACPZ-3.3-R7
|
|
8-WFDFN Exposed Pad, CSP |
|
|
|
|
Samtec Inc. |
ADP2504ACPZ-5.0-R7
|
|
10-VFDFN Exposed Pad, CSP |
|
|
|
|
Walsin Technology Corporation |
SIC471ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
Samtec Inc. |
LTC3204EDC-5#TRPBF
|
|
6-WFDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADP2370ACPZ-R7
|
|
8-WFDFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1556ETB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADP2118ACPZ-R7
|
|
16-WQFN Exposed Pad, CSP |
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