|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Linear Devices Inc. |
UCC5343M
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
PEF82902F
|
|
64-LQFP |
|
|
|
|
MaxLinear, Inc. |
SI32287-A-GMR
|
|
56-VFQFN Exposed Pad |
|
|
|
|
MaxLinear, Inc. |
SI32171-C-GM1R
|
|
42-WFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
PEB7274HV1.2
|
|
|
|
|
|
|
MaxLinear, Inc. |
SI32184-A-FM
|
|
40-VFQFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HC5515IP
|
|
22-DIP (0.400", 10.16mm) |
|
|
|
|
Quatech-Division of B&B Electronics |
HC55143IM
|
|
32-LCC (J-Lead) |
|
|
|
|
FinishAdapt Limited |
PSB8430ZDW
|
|
|
|
|
|
|
Micross Components |
ZL50020GAG2
|
|
256-BGA |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL5585BIMZ-T
|
|
28-LCC (J-Lead) |
|
|
|
|
Quatech-Division of B&B Electronics |
HC5547CMS2584
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
DS2175S+T&R
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Z-World |
BCM65239C0IFSBG
|
|
- |
|
|
|
|
Z-World |
BCM68385CIFSBG
|
|
- |
|
|
|
|
IXYS Integrated Circuits Division |
DS2155L
|
|
100-LQFP |
|
|
|
|
FinishAdapt Limited |
PSB 6970 HL V1.3
|
|
100-LQFP Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
CPC7581MC
|
|
16-VDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
73M1866B-IMR/F
|
|
42-VFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
M-984-02P
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2156L+
|
|
100-LQFP |
|
|
|
|
Z-World |
BCM56072A0KFSBG
|
|
896-BFBGA, FCBGA |
|
|
|
|
ON SEMICONDUCTOR |
TDA18264HB/C1
|
|
80-TFQFN Exposed Pad |
|
|
|
|
Z-World |
BCM56626B2IFSBLG
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
DS2172T+TR
|
|
32-TQFP |
|
|
|
|
Quatech-Division of B&B Electronics |
HC9P5504B-5
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Laird - Wireless & Thermal Systems |
TS190PTR
|
|
8-SMD, Gull Wing |
|
|
|
|
FinishAdapt Limited |
CYV15G0404RB-BGC
|
|
256-BGA Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HC3-5504-5X154
|
|
|
|
|
|
|
FinishAdapt Limited |
PEF22624EV1.3-G
|
|
324-LBGA |
|
|
|
