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Part Number |
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Details |
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IXYS Integrated Circuits Division |
MAX4506CSA+T
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8-SOIC (0.154", 3.90mm Width) |
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Micross Components |
HCS360-I/SN
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8-SOIC (0.154", 3.90mm Width) |
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Micross Components |
HCS361-I/P
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8-DIP (0.300", 7.62mm) |
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Micross Components |
HCS365/P
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8-DIP (0.300", 7.62mm) |
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Micross Components |
HCS361-I/SN
|
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8-SOIC (0.154", 3.90mm Width) |
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|
IXYS Integrated Circuits Division |
DS28E36BQ+T
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|
6-WDFN Exposed Pad |
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Micross Components |
HCS410-I/SN
|
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8-SOIC (0.154", 3.90mm Width) |
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Brady Corporation |
STSAFA110DFSPL03
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8-UFDFN Exposed Pad |
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IXYS Integrated Circuits Division |
DS24L65P+
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Micross Components |
HCS360/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
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|
Micross Components |
HCS410T-I/SN
|
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8-SOIC (0.154", 3.90mm Width) |
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|
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Micross Components |
HCS362-I/ST
|
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8-TSSOP (0.173", 4.40mm Width) |
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Samtec Inc. |
AD9941BSTZRL
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|
48-LQFP |
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IXYS Integrated Circuits Division |
DS2413Q+T&R
|
|
6-WDFN Exposed Pad |
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Micross Components |
HCS410T/SN
|
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8-SOIC (0.154", 3.90mm Width) |
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|
Samtec Inc. |
AD9970BCPZRL
|
|
32-VFQFN Exposed Pad, CSP |
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FinishAdapt Limited |
FM31278-GTR
|
|
14-SOIC (0.154", 3.90mm Width) |
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|
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Micross Components |
HCS500/SM
|
|
8-SOIC (0.209", 5.30mm Width) |
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|
|
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Micross Components |
HCS410/P
|
|
8-DIP (0.300", 7.62mm) |
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|
|
|
Samtec Inc. |
AD8452ASTZ-RL
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|
48-LQFP |
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|
Brady Corporation |
L9691-TR
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|
128-TQFP Exposed Pad |
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Micross Components |
HCS362T-I/ST
|
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8-TSSOP (0.173", 4.40mm Width) |
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|
|
|
Brady Corporation |
L9390
|
|
100-TQFP Exposed Pad |
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FinishAdapt Limited |
FM31L278-GTR
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14-SOIC (0.154", 3.90mm Width) |
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|
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|
Samtec Inc. |
AD9867BCPZ
|
|
64-VFQFN Exposed Pad, CSP |
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Brady Corporation |
ST2100TR
|
|
373-TFBGA |
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|
Aavid Thermalloy |
HDL6M05543
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|
64-VFQFN Exposed Pad |
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Micross Components |
HCS361T-I/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
HCS365-I/SM
|
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8-SOIC (0.209", 5.30mm Width) |
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|
IXYS Integrated Circuits Division |
MAX20800TPBB+
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|
10-PowerVQFN |
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