|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Thermal Solutions Inc. |
AF82SM35
|
|
493-TFBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
LE82Q965
|
|
|
|
|
|
|
BeagleBoard.org |
UC2633N-G
|
|
|
|
|
|
|
Samtec Inc. |
AD890JP
|
|
28-LCC (J-Lead) |
|
|
|
|
Advanced Thermal Solutions Inc. |
FW82801EB
|
|
460-BBGA |
|
|
|
|
MG Chemicals |
GS9001-CQM
|
|
44-QFP |
|
|
|
|
MG Chemicals |
GS9002ACPM
|
|
44-LCC (J-Lead) |
|
|
|
|
BeagleBoard.org |
74LS626N
|
|
|
|
|
|
|
Quatech-Division of B&B Electronics |
HSP45240JC-33
|
|
68-LCC (J-Lead) |
|
|
|
|
Samtec Inc. |
AD880AJR
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
HSP45240JC-50
|
|
68-LCC (J-Lead) |
|
|
|
|
BeagleBoard.org |
74LS681N
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
NH82801EB
|
|
460-BBGA |
|
|
|
|
MG Chemicals |
GS9000DCPJ
|
|
28-LCC (J-Lead) |
|
|
|
|
Advanced Thermal Solutions Inc. |
FW82801DB
|
|
421-BGA, FCBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX66301ETN+
|
|
56-WFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
DLPC2607ZVB
|
|
176-VFBGA |
|
|
|
|
BeagleBoard.org |
74167N
|
|
|
|
|
|
|
Samtec Inc. |
AD9970BCPZ
|
|
32-VFQFN Exposed Pad, CSP |
|
|
|
|
SolidRun LTD |
DP8341N
|
|
24-DIP (0.600", 15.24mm) |
|
|
|
|
Samtec Inc. |
AD880JR
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
UC137L/80115
|
|
|
|
|
|
|
Olimex Ltd. |
LS19-P
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
LTM2889CY-3#PBF
|
|
32-BBGA Module |
|
|
|
|
MG Chemicals |
GS9035CCPJ
|
|
28-LCC (J-Lead) |
|
|
|
|
BeagleBoard.org |
74185AN
|
|
|
|
|
|
|
BeagleBoard.org |
74LS56P
|
|
|
|
|
|
|
Samtec Inc. |
LTM2889CY-5#PBF
|
|
32-BBGA Module |
|
|
|
|
MG Chemicals |
GS1514-CKD
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
BeagleBoard.org |
54LS160A/BEA
|
|
|
|
|
|
