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Special Purpose Amplifiers

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Laird - Wireless & Thermal Systems
IX9915NTR
8-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX4374HEUB+TG05
IXYS Integrated Circuits Division
MAX3969E/D
Die
IXYS Integrated Circuits Division
MAX4374TEUB+TG05
IXYS Integrated Circuits Division
MAX2038CCQ+D
100-TQFP Exposed Pad
onsemi
WM2002GEFL
48-WFQFN Exposed Pad
Samtec Inc.
LT6108HDCB-1
8-WFDFN Exposed Pad
Omron Electronics Inc-EMC Div
LM392DR2G
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LT6108IDCB-1
8-WFDFN Exposed Pad
Samtec Inc.
LT6108IDCB-2
8-WFDFN Exposed Pad
Micross Components
MCP6S92T-E/MSVAO
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Samtec Inc.
SMP08FS-REEL
16-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX20757ETMA1+
Samtec Inc.
LTC6360HDD
8-WFDFN Exposed Pad
Samtec Inc.
LTC6912CDE-2
12-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX20756ETM+
Samtec Inc.
LTC6360IDD
8-WFDFN Exposed Pad
Boundary Devices
M02046G-14
16-LSSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX3265EUE+T
16-TSSOP (0.173", 4.40mm Width) Exposed Pad
Boundary Devices
M02046G-24
16-LSSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX3710ETG+
Boundary Devices
M02049G-14
16-VFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX3864E/D-B3A
Boundary Devices
M02050G-14
16-VFQFN Exposed Pad
Boundary Devices
M02045-2Y04-T
16-SOIC (0.154", 3.90mm Width)
Boundary Devices
M02140G-12
24-QFN
Boundary Devices
M03061-5F06-T
-
IXYS Integrated Circuits Division
MAX3768CUB+
Boundary Devices
M02042-3A-SPBG
-
Boundary Devices
M02042-3A-SPBGF-I
-
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