|
Part Number |
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|
|
|
Details |
|
|
|
Samtec Inc. |
ADG1409SRUZ-EP-RL7
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3095CEE
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
HC55185FCR
|
|
32-VQFN Exposed Pad |
|
|
|
|
Transphorm |
PI2EQX3211BHE
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
DS8921AMX/NOPB
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
|
|
IXYS Integrated Circuits Division |
MAX3098EACPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Linear Devices Inc. |
PCF8574NE4
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX481EPA
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX397CAI+T
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Micross Components |
USB3310C-CP-TR
|
|
24-VFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TRS3232ECPWR
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Transphorm |
PI2EQX3421ZHEX
|
|
28-VFQFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HIN237IB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX394EUP+T
|
|
20-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
PCA9615DPJ
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3096CSE
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI2EQX4951SLZDEX
|
|
20-WFQFN Exposed Pad |
|
|
|
|
Quatech-Division of B&B Electronics |
HIN237IBR4327
|
|
|
|
|
|
|
ebm-papst Inc. |
CD22204M
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
VersaLogic Corporation |
PCA9675PW,118
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3120CUA
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Micross Components |
USB3343-CP-TR
|
|
24-VFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
CY7C65223-24LTXI
|
|
24-UFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
PCF8574ANE4
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Transphorm |
PI2EQX6741SLZDEX
|
|
20-WFQFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HC4P5504B1-5
|
|
28-LCC (J-Lead) |
|
|
|
|
Micross Components |
MCP2140-I/SS
|
|
20-SSOP (0.209", 5.30mm Width) |
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|
|
|
Transphorm |
PI2EQX6814NJEX
|
|
100-LBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3095CSE
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4602CAE+
|
|
16-SSOP (0.209", 5.30mm Width) |
|
|
|
