|
Part Number |
|
|
|
|
Details |
|
|
|
Samtec Inc. |
ADG4613BRUZ-REEL7
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Laird - Wireless & Thermal Systems |
TS117S
|
|
8-SMD, Gull Wing |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3245ECB
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
onsemi |
CS4223-KSZR
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Nidec Copal Electronics |
TC7WB67CFK,LF(CT
|
|
8-VFSOP (0.091", 2.30mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX7313AEG+
|
|
24-SSOP (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4736ETC+
|
|
12-WFQFN Exposed Pad |
|
|
|
|
Wandboard.Org |
74LVC1G66GW,125
|
|
5-TSSOP, SC-70-5, SOT-353 |
|
|
|
|
NetBurner Inc. |
ISD1750EY
|
|
28-TSSOP (0.465", 11.80mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
MC74VHC1G66DFT1G
|
|
5-TSSOP, SC-70-5, SOT-353 |
|
|
|
|
Advanced Linear Devices Inc. |
SN75DP119RHHR
|
|
36-VFQFN Exposed Pad |
|
|
|
|
Quatech-Division of B&B Electronics |
HIN202ECBN
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
NetBurner Inc. |
ISD5104SYI
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3238ECB
|
|
|
|
|
|
|
Micross Components |
VSC8486YJB-11
|
|
144-LBGA, FCBGA |
|
|
|
|
Quatech-Division of B&B Electronics |
ISL4486IB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3232CV
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
NetBurner Inc. |
ISD1790EY
|
|
28-TSSOP (0.465", 11.80mm Width) |
|
|
|
|
Micross Components |
MCP23S09T-E/MG
|
|
16-VFQFN Exposed Pad |
|
|
|
|
SolidRun LTD |
LMS1487CMX
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
MPL360BT-I/Y8X
|
|
48-TQFP |
|
|
|
|
ebm-papst Inc. |
HIN202ACA
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3227EUE
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Samtec Inc. |
AD238JR-REEL
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX233CPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
HIN236CP
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX233EPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2408S+T&R
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DG413CUE+T
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
VSC8540XMV-05
|
|
68-VFQFN Exposed Pad |
|
|
|
