|
Part Number |
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|
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|
Details |
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|
|
Transphorm |
PI3EQX10908ZFE
|
|
56-WFQFN Exposed Pad |
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|
|
|
IXYS Integrated Circuits Division |
MAX13088EASA
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
|
|
Transphorm |
PI3EQX10964ZFEX
|
|
56-WFQFN Exposed Pad |
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|
|
|
Laird - Wireless & Thermal Systems |
IAA110PTR
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
EL1528CRE
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
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|
Micross Components |
USB5916CT/KD
|
|
100-VFQFN Exposed Pad |
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|
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|
IXYS Integrated Circuits Division |
MAX313LETP+
|
|
20-WQFN Exposed Pad |
|
|
|
|
Micross Components |
USB5806CT/KD
|
|
100-VFQFN Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
PCA9704PWJ
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX338MSE/PR3+T
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX336EUI+T
|
|
28-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
KSZ8893FQL
|
|
128-BFQFP |
|
|
|
|
Advanced Linear Devices Inc. |
TRS3318EIPWR
|
|
20-TSSOP (0.173", 4.40mm Width) |
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|
|
|
IXYS Integrated Circuits Division |
MAX358CWE+
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Transphorm |
PI2EQX8804ANJE
|
|
100-LBGA |
|
|
|
|
Advanced Linear Devices Inc. |
TUSB2046BIRHBT
|
|
32-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX394EWP+
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Micross Components |
UPD301C-I/KYX
|
|
40-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3096CEE
|
|
16-SSOP (0.154", 3.90mm Width) |
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|
|
|
Quatech-Division of B&B Electronics |
HC4P5509A1R3060
|
|
28-LCC (J-Lead) |
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|
|
|
ebm-papst Inc. |
HIN230IB
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
PCF8575DGVR
|
|
24-TFSOP (0.173", 4.40mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
PCAL9539AHF,128
|
|
24-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3098EBCSE
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX307CWI+
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
HIN241IA
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX13087EEPA
|
|
8-DIP (0.300", 7.62mm) |
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|
|
|
Alpha & Omega Semiconductor Inc. |
ISL81487EIBZ
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
|
|
Micross Components |
COM20020I3V-DZD
|
|
28-LCC (J-Lead) |
|
|
|
|
ebm-papst Inc. |
HIN239IB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
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