|
Part Number |
|
|
|
|
Details |
|
|
Advanced Thermal Solutions Inc. |
N82C55A2
|
|
44-LCC (J-Lead) |
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|
|
Micross Components |
USB2517-JZX-TR
|
|
64-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX13342EEBC-
|
|
|
|
|
|
ebm-papst Inc. |
IS82C55A
|
|
44-LCC (J-Lead) |
|
|
|
onsemi |
CS61574A-IP1
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
Micross Components |
ENC424J600-I/ML
|
|
44-VQFN Exposed Pad |
|
|
|
Laird Thermal Systems, Inc. |
EL1517BILZ-T7
|
|
16-VQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX4623ESE+T
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
Laird - Wireless & Thermal Systems |
CPC5712U
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
ON SEMICONDUCTOR |
PCA9538ABS,128
|
|
|
|
|
|
Advanced Linear Devices Inc. |
DS160UP822NJXT
|
|
64-WFQFN Exposed Pad |
|
|
|
Micross Components |
USB5744/2G
|
|
56-VFQFN Exposed Pad |
|
|
|
Transphorm |
PI4IOE5V6416AQ2LEX
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
ebm-papst Inc. |
CP82C55A
|
|
40-DIP (0.600", 15.24mm) |
|
|
|
Omron Electronics Inc-EMC Div |
LC73872MK-TRM-E
|
|
|
|
|
|
ebm-papst Inc. |
HIN202IB
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
IXYS Integrated Circuits Division |
DS2154L
|
|
100-LQFP |
|
|
|
SolidRun LTD |
LM2893M
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
EAO |
FT4232HL-TRAY
|
|
64-LQFP |
|
|
|
onsemi |
CS62180B-IL/C
|
|
|
|
|
|
Advanced Linear Devices Inc. |
TMUX1136DQAR
|
|
10-UFDFN |
|
|
|
Quatech-Division of B&B Electronics |
HIN236CB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
SolidRun |
ASNT5024-KMC
|
|
24-CFlatPack |
|
|
|
IXYS Integrated Circuits Division |
MAX7324AEG
|
|
24-SSOP (0.154", 3.90mm Width) |
|
|
|
Samtec Inc. |
ADG701LBRTZ-REEL7
|
|
SOT-23-6 |
|
|
|
SolidRun |
ASNT5021
|
|
24-VFQFN Exposed Pad |
|
|
|
Micross Components |
PM5326-FEI
|
|
- |
|
|
|
Micross Components |
KSZ8851SNLI-TR
|
|
32-VFQFN Exposed Pad |
|
|
|
Micross Components |
USB4715T-I/Y9X
|
|
48-VFQFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
ISL5571AIBZ
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|