|
Part Number |
|
|
|
|
Details |
|
|
|
Micross Components |
AT89C51RB2-3CSUM
|
|
40-DIP (0.600", 15.24mm) |
|
|
|
|
SolidRun LTD |
GAL20V8QS-25QVC
|
|
|
|
|
|
|
VersaLogic |
CY37032P44-125JI
|
|
44-LCC (J-Lead) |
|
|
|
|
Brady Corporation |
STM32L451RCT6
|
|
64-LQFP |
|
|
|
|
API Delevan Inc. |
XC5VLX220-1FF1760I
|
|
1760-BBGA, FCBGA |
|
|
|
|
ON SEMICONDUCTOR |
SAF7771EL/200Z10AK
|
|
|
|
|
|
|
API Delevan Inc. |
XC5VLX220-1FFG1760I
|
|
1760-BBGA, FCBGA |
|
|
|
|
American Technical Ceramics |
GAL16LV8C-15LJ
|
|
20-LCC (J-Lead) |
|
|
|
|
Micross Components |
PIC16C64A-04/P
|
|
40-DIP (0.600", 15.24mm) |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SG250HH2F55I1VG
|
|
2912-BBGA, FCBGA |
|
|
|
|
API Delevan Inc. |
XCKU085-2FLVF1924I
|
|
1924-BBGA, FCBGA |
|
|
|
|
TE Connectivity / Corcom |
EP610PC-35-AL
|
|
24-DIP |
|
|
|
|
Brady Corporation |
STM32G491CCU6
|
|
48-UFQFN Exposed Pad |
|
|
|
|
TE Connectivity / Corcom |
EPM7032BUC49-7
|
|
49-LFBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SG250HN2F43I1VG
|
|
1760-BBGA, FCBGA |
|
|
|
|
ON SEMICONDUCTOR |
SAF7770EL/200Z10AY
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
EP3SL340F1517C2G
|
|
|
|
|
|
|
Brady Corporation |
STM32L452RCT6
|
|
64-LQFP |
|
|
|
|
API Delevan Inc. |
XC6SLX4-3TQG144C
|
|
144-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SG280HN2F43E2LG
|
|
1760-BBGA, FCBGA |
|
|
|
|
ON SEMICONDUCTOR |
SAF775DHV/N208W/GK
|
|
|
|
|
|
|
API Delevan Inc. |
XC5VLX155T-2FF1738I
|
|
1738-BBGA, FCBGA |
|
|
|
|
Micross Components |
A54SX72A-CQ256
|
|
256-BFCQFP with Tie Bar |
|
|
|
|
Micross Components |
PIC32MK0512MCJ064-I/R4X
|
|
64-VFQFN Exposed Pad |
|
|
|
|
American Technical Ceramics |
PALLV16V8-10JC
|
|
20-LCC (J-Lead) |
|
|
|
|
American Technical Ceramics |
LCMXO1200C-4TN100I
|
|
100-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
5M40ZM64C5N
|
|
64-TFBGA |
|
|
|
|
Micross Components |
PIC16C924-04/L
|
|
68-LCC (J-Lead) |
|
|
|
|
ON SEMICONDUCTOR |
SAF775DHV/N208W/GY
|
|
|
|
|
|
|
API Delevan Inc. |
XC7V585T-1FF1157I
|
|
1156-BBGA, FCBGA |
|
|
|
