|
Part Number |
|
|
|
|
Details |
|
|
|
Micross Components |
APA450-FGG484
|
|
484-BGA |
|
|
|
|
Samtec Inc. |
ADSP-2101KS-80
|
|
80-BQFP |
|
|
|
|
Samtec Inc. |
ADSP-BF526KBCZ-3
|
|
289-LFBGA, CSPBGA |
|
|
|
|
TE Connectivity / Corcom |
EP20K200CF484C9
|
|
484-BBGA |
|
|
|
|
Micross Components |
M1AFS1500-1FGG484
|
|
484-BGA |
|
|
|
|
Honeywell Sensing and Productivity Solutions |
C8051F920-G-GQR
|
|
32-LQFP |
|
|
|
|
Micross Components |
APA450-FG484
|
|
484-BGA |
|
|
|
|
API Delevan Inc. |
XCV400-4HQ240C0729
|
|
|
|
|
|
|
Samtec Inc. |
ADSP-BF526KBCZ-4C2
|
|
289-LFBGA, CSPBGA |
|
|
|
|
API Delevan Inc. |
XCV400E-7BG432C0773
|
|
|
|
|
|
|
BeagleBoard.org |
P8273-4
|
|
|
|
|
|
|
Micross Components |
M1AFS1500-1FG484
|
|
484-BGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
5SGSMD5K3F40C2LG
|
|
1517-BBGA, FCBGA |
|
|
|
|
BeagleBoard.org |
P82050
|
|
|
|
|
|
|
TE Connectivity / Corcom |
EP1SGX10DF672C6N
|
|
672-BGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1789EUI+CBH
|
|
|
|
|
|
|
NMB Technologies Corporation |
AM29C10API
|
|
|
|
|
|
|
Micross Components |
PIC16F648A-I/P
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
ADSP-21MOD880-000
|
|
|
|
|
|
|
SolaHD |
UC1526AJ/80516
|
|
|
|
|
|
|
Sumida America Components Inc. |
NS9215B-0-I75
|
|
265-LFBGA |
|
|
|
|
Micross Components |
M1A3PE3000-PQG208I
|
|
208-BFQFP |
|
|
|
|
Samtec Inc. |
ADSP-2101BP-66
|
|
68-LCC (J-Lead) |
|
|
|
|
TE Connectivity / Corcom |
EPF10K100AFC484-2
|
|
484-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
5SGSED6K3F40C3G
|
|
1517-BBGA, FCBGA |
|
|
|
|
Micross Components |
PIC18F46K22T-I/PT
|
|
44-TQFP |
|
|
|
|
TE Connectivity / Corcom |
EPF10K130EBC356-2
|
|
356-LBGA |
|
|
|
|
Micross Components |
PIC18F45K22-I/PT
|
|
44-TQFP |
|
|
|
|
Samtec Inc. |
ADSP-21371BSWZ-2B
|
|
208-LQFP Exposed Pad |
|
|
|
|
Samtec Inc. |
ADSP-21MSP55AKS-52
|
|
100-BQFP |
|
|
|
