|
Part Number |
|
|
|
|
Details |
|
|
|
Brady Corporation |
M24C32-DRMN8TP/K
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
BI Technologies |
CAT24C64YGI
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
FinishAdapt Limited |
CY7C1472V25-200AXCT
|
|
100-LQFP |
|
|
|
|
Quatech-Division of B&B Electronics |
X28HC256J-15C7960
|
|
32-LCC (J-Lead) |
|
|
|
|
FinishAdapt Limited |
CY7C1472V33-167AXI
|
|
100-LQFP |
|
|
|
|
Micross Components |
93AA46A-I/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Brady Corporation |
M93C46-RMN3TP/K
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
CY7C1472V33-167AXIT
|
|
100-LQFP |
|
|
|
|
KEMET Corporation |
AT45DB041D-MU-SL955
|
|
8-VDFN Exposed Pad |
|
|
|
|
Brady Corporation |
M24C64-WMN6P
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Brady Corporation |
M24C64-RMN6P
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
BI Technologies |
CAT93C66VGI-1.8
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
S25FL256SAGNFB003
|
|
8-WDFN Exposed Pad |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
P47P0975
|
|
|
|
|
|
|
FinishAdapt Limited |
CY7C1480V33-167AXCT
|
|
100-LQFP |
|
|
|
|
Omron Electronics Inc-EMC Div |
CAT34C02HU3I-GT4
|
|
8-UFDFN Exposed Pad |
|
|
|
|
EPCOS (TDK) |
IS43LR16640C-5BLI
|
|
60-TFBGA |
|
|
|
|
Micross Components |
93C46B/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
S25FL256SAGMFB003
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
BI Technologies |
CAT93C86LI-G
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
FinishAdapt Limited |
CY7C1512V18-167BZXI
|
|
165-LBGA |
|
|
|
|
Micross Components |
93C46B-I/SN
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
S25FL256SDPBHB210
|
|
24-TBGA |
|
|
|
|
FinishAdapt Limited |
CY7C1512V18-250BZXC
|
|
165-LBGA |
|
|
|
|
KEMET Corporation |
AT25DQ321-S3H-T
|
|
8-SOIC (0.209", 5.30mm Width) |
|
|
|
|
BeagleBoard.org |
MD2114AL-4/B
|
|
|
|
|
|
|
FinishAdapt Limited |
S25FL256SDSBHB213
|
|
24-TBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
P01L6932-1
|
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
3288H4996-1
|
|
|
|
|
|
|
FinishAdapt Limited |
CY7C1525V18-200BZXC
|
|
165-LBGA |
|
|
|
