|
Part Number |
|
|
|
|
Details |
|
|
|
BI Technologies |
CAT28LV64GI-15
|
|
32-LCC (J-Lead) |
|
|
|
|
NJR Corporation/NJRC |
MT47H128M8BT-3 L:A
|
|
92-TFBGA |
|
|
|
|
BI Technologies |
CAT28F020HI-90
|
|
32-TFSOP (0.724", 18.40mm Width) |
|
|
|
|
NJR Corporation/NJRC |
MT58L128L36F1T-8.5IT
|
|
100-LQFP |
|
|
|
|
ON SEMICONDUCTOR |
MKL46Z128VLH4,557
|
|
|
|
|
|
|
NJR Corporation/NJRC |
MT47H128M8BT-5E L:A
|
|
92-TFBGA |
|
|
|
|
NJR Corporation/NJRC |
MTFC128GAVATTC-AAT
|
|
153-LFBGA |
|
|
|
|
FinishAdapt Limited |
CY7C1418KV18-333BZC
|
|
165-LBGA |
|
|
|
|
NJR Corporation/NJRC |
MT46V64M8P-5B:F
|
|
66-TSSOP (0.400", 10.16mm Width) |
|
|
|
|
NJR Corporation/NJRC |
MT47H32M16CC-37E L:B TR
|
|
84-TFBGA |
|
|
|
|
NJR Corporation/NJRC |
MT47H32M16CC-3E:B
|
|
84-TFBGA |
|
|
|
|
FinishAdapt Limited |
CY7C1414KV18-333BZXI
|
|
165-LBGA |
|
|
|
|
FinishAdapt Limited |
CY7C1420KV18-333BZXI
|
|
165-LBGA |
|
|
|
|
NJR Corporation/NJRC |
MT47H32M16CC-3E:B TR
|
|
84-TFBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
INT0000006K1309
|
|
|
|
|
|
|
FinishAdapt Limited |
CY7C1423KV18-333BZXC
|
|
165-LBGA |
|
|
|
|
VersaLogic |
CG4158AM
|
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
INT70P0143
|
|
|
|
|
|
|
FinishAdapt Limited |
CY7C1412KV18-333BZC
|
|
165-LBGA |
|
|
|
|
NJR Corporation/NJRC |
MT62F1G64D8EK-031 AAT:B
|
|
441-TFBGA |
|
|
|
|
FinishAdapt Limited |
CY62177EV30LL-55ZXIT
|
|
48-TFSOP (0.724", 18.40mm Width) |
|
|
|
|
BI Technologies |
CAT93C76YGI-T3
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
3229P2294-1
|
|
|
|
|
|
|
NJR Corporation/NJRC |
MT29VZZZCDA1SKPR-046 W.181 TR
|
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
INT70P1327
|
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
INT05N9690
|
|
|
|
|
|
|
FinishAdapt Limited |
CY7C1414KV18-333BZC
|
|
165-LBGA |
|
|
|
|
Micross Components |
AT49LV321-90CI
|
|
48-TFBGA, CSPBGA |
|
|
|
|
NJR Corporation/NJRC |
MT47H16M16BG-37V:B
|
|
84-FBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
INT70P1779
|
|
|
|
|
|
