|
Part Number |
|
|
|
|
Details |
|
|
|
BeagleBoard.org |
MR2764A-35/BZA
|
|
|
|
|
|
|
NJR Corporation/NJRC |
M25P80-VMW6G
|
|
8-SOIC (0.209", 5.30mm Width) |
|
|
|
|
NJR Corporation/NJRC |
M25P20-VMP6G
|
|
8-VDFN Exposed Pad |
|
|
|
|
NMB Technologies Corporation |
AM27S191SA/BUA
|
|
32-CLCC |
|
|
|
|
NJR Corporation/NJRC |
M25P32-VME6G
|
|
8-VDFN Exposed Pad |
|
|
|
|
API Technologies Corp. |
AT25QL641-MHE-T
|
|
8-UDFN Exposed Pad |
|
|
|
|
NMB Technologies Corporation |
AM27S191SA/B3A
|
|
28-CLCC |
|
|
|
|
NJR Corporation/NJRC |
M25P40-VMN6
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
UPD48288218AFF-E33-DW1-E2-A
|
|
|
|
|
|
|
Micross Components |
SST25VF020B-80-4C-QAE
|
|
8-WDFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
UPD48576218FF-E18-DW1-A
|
|
|
|
|
|
|
Broadcom |
A3565142-C
|
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
25CPC700BB3B66
|
|
474-BCBGA Exposed Pad |
|
|
|
|
Broadcom |
506061-001-C
|
|
|
|
|
|
|
Broadcom |
A0735489-C
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
R8207-10
|
|
68-CLCC |
|
|
|
|
Broadcom |
A3858998-C
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
A82078
|
|
68-CPGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
04188CBLBB-30
|
|
- |
|
|
|
|
Advanced Thermal Solutions Inc. |
KU82309-25
|
|
100-QFP Bumpered |
|
|
|
|
Broadcom |
A5649221-C
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
SMJ44400-80HMM
|
|
|
|
|
|
|
NMB Technologies Corporation |
AM27S191SA/BKA
|
|
24-CFlatpack |
|
|
|
|
NMB Technologies Corporation |
AM27S181A/BUA
|
|
32-CLCC |
|
|
|
|
Advanced Thermal Solutions Inc. |
KU82309-20
|
|
100-QFP Bumpered |
|
|
|
|
Broadcom |
C-800D2N5/2G
|
|
|
|
|
|
|
NJR Corporation/NJRC |
M25P40-VMP6G
|
|
8-VDFN Exposed Pad |
|
|
|
|
Brady Corporation |
M27C1001-10C6
|
|
32-LCC (J-Lead) |
|
|
|
|
NJR Corporation/NJRC |
M25P40-VMP6TG TR
|
|
8-VDFN Exposed Pad |
|
|
|
|
Broadcom |
A1979736-C
|
|
|
|
|
|
