|
Part Number |
|
|
|
|
Details |
|
|
Samtec Inc. |
LT3756EUD#TRPBF
|
|
16-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LT3756IMSE-2#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
MaxLinear, Inc. |
SKY81290-11-563LFJ
|
|
14-WFDFN Exposed Pad |
|
|
|
MaxLinear, Inc. |
SKY81294-17-001
|
|
9-BGA, WLCSP |
|
|
|
MaxLinear, Inc. |
SKY81294-14-001
|
|
9-BGA, WLCSP |
|
|
|
Samtec Inc. |
LT3942EUFD#TRPBF
|
|
28-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LT3932EUFD#TRPBF
|
|
28-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LT3761EMSE#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
Torex Semiconductor Ltd |
BD94130MUF-ME2
|
|
56-VFQFN Exposed Pad |
|
|
|
Torex Semiconductor Ltd |
BD94130EFV-ME2
|
|
54-VSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
ABB Power Electronics Inc. |
THL3502-B
|
|
48-VFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LT3761AEMSE#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
Samtec Inc. |
LT3922EUFD#TRPBF
|
|
28-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LT3598EFE#TRPBF
|
|
24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
FinishAdapt Limited |
ILD1151
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3178-STLA3-TR
|
|
SOT-23-6 |
|
|
|
FinishAdapt Limited |
TLD1121ELXUMA1
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
Laird Technologies - Thermal Materials |
IS31LT3172-GRLS4-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
BCM Advanced Research |
MIC2292-15YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
FinishAdapt Limited |
TLD21313EPXUMA1
|
|
14-TSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
BCM Advanced Research |
MIC2291YD5
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
Advanced Linear Devices Inc. |
TLC59282RGER
|
|
24-VFQFN Exposed Pad |
|
|
|
Laird Technologies - Thermal Materials |
IS31BL3230-QFLS2-TR
|
|
16-WFQFN Exposed Pad |
|
|
|
FinishAdapt Limited |
TLD1313ELXUMA1
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
MaxLinear, Inc. |
Q845B3EBD-T
|
|
|
|
|
|
FinishAdapt Limited |
BCR431UXTSA1
|
|
SOT-23-6 |
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3174-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
BCM Advanced Research |
MIC2287-15YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
BCM Advanced Research |
MIC2289-24YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3178-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|