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Part Number |
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Details |
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IXYS Integrated Circuits Division |
MAX16833CAUE/V+QA
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16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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ECSInternational |
AP2063AEC
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IXYS Integrated Circuits Division |
MAX1575ETE/V+T
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16-WQFN Exposed Pad |
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Raltron Electronics |
MP1519DQTL-LF-Z
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16-VFQFN Exposed Pad |
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IXYS Integrated Circuits Division |
MAX16821BATI+TW
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|
28-WFQFN Exposed Pad |
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Raltron Electronics |
MP1519DQL-LF-Z
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16-VFQFN Exposed Pad |
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Laird Technologies - Thermal Materials |
IS32LT3181-ZLA3
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16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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Advanced Linear Devices Inc. |
LM3421Q1MH/NOPB
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16-PowerTSSOP (0.173", 4.40mm Width) |
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Signal Transformer |
ALT80601KESJSR
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MaxLinear, Inc. |
AAT2439AIDX-T1
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|
- |
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MaxLinear, Inc. |
AAT2823AIBK-1-T1
|
|
24-WFQFN Exposed Pad |
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IXYS Integrated Circuits Division |
MAX16814CAGP/VY+
|
|
20-VFQFN Exposed Pad |
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MaxLinear, Inc. |
SKY81290-11-563LF
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14-WFDFN Exposed Pad |
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Omron Electronics Inc-EMC Div |
NCL30386B2DR2G
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10-SOP (0.154", 3.90mm Width), 9 Leads |
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Omron Electronics Inc-EMC Div |
SCV78663DQ2R2G
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Laird Technologies - Thermal Materials |
IS32LT3957-ZLA3-TR
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|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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FinishAdapt Limited |
CY39C605PNF-G-JNE1
|
|
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Torex Semiconductor Ltd |
BD7880MUV-E2
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Laird Technologies - Thermal Materials |
IS32FL3209-ZLA3
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28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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Laird Technologies - Thermal Materials |
IS31FL3733A-QFLS4-TR
|
|
48-WFQFN Exposed Pad |
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FinishAdapt Limited |
CY39C604PNF-G-JNE1
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All Flex Inc. |
AS1102-Z
|
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6-TSSOP, SC-88, SOT-363 |
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Laird Technologies - Thermal Materials |
IS31FL3736A-QFLS4-TR
|
|
40-WFQFN Exposed Pad |
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Transphorm |
AP1684AMTR-G1
|
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8-SOIC (0.154", 3.90mm Width) |
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Laird Technologies - Thermal Materials |
IS31FL3737A-QFLS4-TR
|
|
40-WFQFN Exposed Pad |
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Brady Corporation |
L99LD01
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|
32-LQFP |
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Transphorm |
AP1681MTR-HG1
|
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8-SOIC (0.154", 3.90mm Width) |
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Transphorm |
AL3022MTR-AG1
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8-SOIC (0.154", 3.90mm Width) |
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Transphorm |
AL3022MTR-BG1
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8-SOIC (0.154", 3.90mm Width) |
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Advanced Linear Devices Inc. |
LM3492QMH/NOPB
|
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20-PowerTSSOP (0.173", 4.40mm Width) |
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