|
Part Number |
|
|
|
|
Details |
|
|
|
ebm-papst Inc. |
DG405EJ
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HI1-0524-5
|
|
18-CDIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
ADV7283WBCPZ
|
|
32-WFQFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3087ECSA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX98090AETL+T
|
|
40-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG528CJ
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
ADM232LJNZ
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Tusonix a Subsidiary of CTS Electronic Components |
DA7212-01UM2
|
|
34-UFBGA, WLCSP |
|
|
|
|
Advanced Linear Devices Inc. |
TL16CP754CPMR
|
|
64-LQFP |
|
|
|
|
Samtec Inc. |
ADM232LJRZ
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9291GTN/V+
|
|
56-WFQFN Exposed Pad |
|
|
|
|
ebm-papst Inc. |
HIN232ACP
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Linear Devices Inc. |
TL16C2752FN
|
|
44-LCC (J-Lead) |
|
|
|
|
Advanced Linear Devices Inc. |
DS91C176TMA/NOPB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
ADM3202ANZ
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
TSI148-133CL
|
|
456-BGA |
|
|
|
|
Advanced Linear Devices Inc. |
TL16C554AIFNR
|
|
68-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
73S8023C-IM/F
|
|
32-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3088ECSA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX7359BETG+T
|
|
24-WFQFN Exposed Pad |
|
|
|
|
Transphorm |
PI7C9X20404SLCFDE
|
|
128-LQFP |
|
|
|
|
Brady Corporation |
STA2058EXATR
|
|
144-LFBGA |
|
|
|
|
Advanced Linear Devices Inc. |
TLV320AIC3206IRSBT
|
|
40-WFQFN Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
TJR1442BT/0Z
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
LMH0341SQ/NOPB
|
|
48-WFQFN Exposed Pad |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3243IA-T
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Inphi Corporation |
LA73050-TLM-E
|
|
|
|
|
|
|
Omron Electronics Inc-EMC Div |
LA73050-TLM-E-ON
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3314EESA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Trenz Electronic GmbH |
TLK10021GWQ
|
|
|
|
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|
