|
Part Number |
|
|
|
|
Details |
|
|
Alpha & Omega Semiconductor Inc. |
HD64F3687GHJ
|
|
|
|
|
|
Rittal |
MCIMX535DVV2C2
|
|
529-FBGA |
|
|
|
Rittal |
MCF5206EAB40
|
|
160-BQFP |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F101GLAFB#30
|
|
48-LQFP |
|
|
|
Advanced Thermal Solutions Inc. |
AGFA014R24B2E4F
|
|
- |
|
|
|
Rittal |
MC68EC000FN8
|
|
68-LCC (J-Lead) |
|
|
|
FinishAdapt Limited |
XE162FN16F80LAAFXUMA1
|
|
64-LQFP Exposed Pad |
|
|
|
Advanced Thermal Solutions Inc. |
GD80960JS25
|
|
196-BGA |
|
|
|
Brady Corporation |
SPC560B50L5B4E0X
|
|
144-LQFP |
|
|
|
Brady Corporation |
SPC560P40L1BEAAR
|
|
64-LQFP |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100GLDFB#30
|
|
48-LQFP |
|
|
|
FinishAdapt Limited |
SAF-XE162FN-40F80L AA
|
|
64-LQFP Exposed Pad |
|
|
|
Advanced Thermal Solutions Inc. |
AGFA012R24C3I3V
|
|
- |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100LKAFB#30
|
|
64-LQFP |
|
|
|
Advanced Thermal Solutions Inc. |
1SX280HU3F50E2VG
|
|
2397-BBGA, FCBGA |
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750GLECR2H33T
|
|
292-BCBGA Exposed Pad |
|
|
|
Micross Components |
PIC16LF1516T-I/ML
|
|
28-VQFN Exposed Pad |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100LLDFB#30
|
|
64-LQFP |
|
|
|
Rittal |
P2041NSN7MMC
|
|
780-BBGA, FCBGA |
|
|
|
Advanced Thermal Solutions Inc. |
1SX250HU3F50I3VG
|
|
2397-BBGA, FCBGA |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F104MGAFA#30
|
|
80-LQFP |
|
|
|
ON SEMICONDUCTOR |
MPC8247CZQMIBA557
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100GKAFB#30
|
|
48-LQFP |
|
|
|
Brady Corporation |
SPC560P34L3CEFAR
|
|
100-LQFP |
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-193E1
|
|
64-LQFP |
|
|
|
ON SEMICONDUCTOR |
MCF5272VM66
|
|
196-LBGA |
|
|
|
Omron Electronics Inc-EMC Div |
LC88F52H0AU-CH-H
|
|
|
|
|
|
Brady Corporation |
SPC560P34L3CEFAY
|
|
100-LQFP |
|
|
|
FinishAdapt Limited |
SAF-XE164KN-24F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
Advanced Thermal Solutions Inc. |
AGFA006R16A2E4X
|
|
- |
|
|