|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Thermal Solutions Inc. |
AGFA014R24B3I3E
|
|
- |
|
|
|
|
FinishAdapt Limited |
SAF-XE164GN-40F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
Micross Components |
TS87C58X2-LIE
|
|
44-QFP |
|
|
|
|
Micross Components |
TS87C54X2-MIC
|
|
44-QFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFB012R24C3I3V
|
|
- |
|
|
|
|
ON SEMICONDUCTOR |
MCIMX7D2DVK12SC557
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F101PLDFB#30
|
|
100-LQFP |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F104LJAFA#30
|
|
64-LQFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-179E1
|
|
64-LQFP |
|
|
|
|
FinishAdapt Limited |
XE162FN16F80LAAFXUMA1
|
|
64-LQFP Exposed Pad |
|
|
|
|
VersaSense |
MC68HC11AOFNR2
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F104MGAFA#30
|
|
80-LQFP |
|
|
|
|
FinishAdapt Limited |
SAF-XE162FN-40F80L AA
|
|
64-LQFP Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
MPC8247CZQMIBA557
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100GKAFB#30
|
|
48-LQFP |
|
|
|
|
Brady Corporation |
SPC560P34L3CEFAR
|
|
100-LQFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-193E1
|
|
64-LQFP |
|
|
|
|
Omron Electronics Inc-EMC Div |
LC88F52H0AU-CH-H
|
|
|
|
|
|
|
Brady Corporation |
SPC560P34L3CEFAY
|
|
100-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFA006R16A2E4X
|
|
- |
|
|
|
|
ON SEMICONDUCTOR |
MCIMX513CJM6C
|
|
529-LFBGA |
|
|
|
|
VersaLogic Corporation |
MCF51QE96CLH557
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
BXC80557E2140
|
|
775-LGA |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HD64F3048VFI8
|
|
|
|
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-210E1
|
|
64-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFA012R24C3I3V
|
|
- |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100LKAFB#30
|
|
64-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX280HU3F50E2VG
|
|
2397-BBGA, FCBGA |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750GLECR2H33T
|
|
292-BCBGA Exposed Pad |
|
|
|
|
Micross Components |
PIC16LF1516T-I/ML
|
|
28-VQFN Exposed Pad |
|
|
|
