|
Part Number |
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Details |
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|
IXYS Integrated Circuits Division |
MAX13342EEBC-
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Micross Components |
ENC424J600-I/ML
|
|
44-VQFN Exposed Pad |
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|
Laird Thermal Systems, Inc. |
EL1517BILZ-T7
|
|
16-VQFN Exposed Pad |
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IXYS Integrated Circuits Division |
MAX22514AWA+
|
|
25-WFBGA, WLBGA |
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|
IXYS Integrated Circuits Division |
MAX4623ESE+T
|
|
16-SOIC (0.154", 3.90mm Width) |
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Laird - Wireless & Thermal Systems |
CPC5712U
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16-SSOP (0.154", 3.90mm Width) |
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Advanced Linear Devices Inc. |
SN75LBC776DB
|
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Advanced Linear Devices Inc. |
DS160PR822NJXR
|
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64-WFQFN Exposed Pad |
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Micross Components |
USB5744/2G
|
|
56-VFQFN Exposed Pad |
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ebm-papst Inc. |
IS82C55A
|
|
44-LCC (J-Lead) |
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Advanced Linear Devices Inc. |
DS560DF810ALUR
|
|
135-LFBGA |
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Advanced Thermal Solutions Inc. |
N82C55A2
|
|
44-LCC (J-Lead) |
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|
Samtec Inc. |
LTC1391IGN#TRPBF
|
|
16-SSOP (0.154", 3.90mm Width) |
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|
onsemi |
CS61574A-IP1
|
|
28-DIP (0.600", 15.24mm) |
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|
IXYS Integrated Circuits Division |
MAX202EESE
|
|
16-SOIC (0.154", 3.90mm Width) |
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Advanced Linear Devices Inc. |
TMUX1136DQAR
|
|
10-UFDFN |
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ebm-papst Inc. |
CP82C55A-5
|
|
40-DIP (0.600", 15.24mm) |
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|
|
|
Quatech-Division of B&B Electronics |
HIN236CB
|
|
24-SOIC (0.295", 7.50mm Width) |
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|
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Samtec Inc. |
ADG701LBRTZ-REEL7
|
|
SOT-23-6 |
|
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|
SolidRun |
ASNT5020-PQD
|
|
|
|
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|
|
Micross Components |
PM5326-FEI
|
|
- |
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|
SolidRun LTD |
LM2893M
|
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20-SOIC (0.295", 7.50mm Width) |
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|
onsemi |
CS62180B-IL/C
|
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|
|
|
|
Micross Components |
KSZ8851SNLI-TR
|
|
32-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
USB4715T-I/Y9X
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Quatech-Division of B&B Electronics |
ISL5571AIBZ
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
SolidRun |
ASNT5024-KMC
|
|
24-CFlatPack |
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|
IXYS Integrated Circuits Division |
MAX7324AEG
|
|
24-SSOP (0.154", 3.90mm Width) |
|
|
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|
SolidRun |
ASNT5021
|
|
24-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3246EEBX
|
|
26-WFBGA, CSPBGA |
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