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Memory

Img
Part Number
Manufacturers
Desc
Enquiry
Packing
Details
ON SEMICONDUCTOR
SAC57D54HCVMO557
FinishAdapt Limited
CY7C131E-15NXI
52-BQFP
FinishAdapt Limited
S25FL256LAGBHI023
24-TBGA
EPCOS (TDK)
IS46TR81024BL-125KBLA1
78-TFBGA
Alpha & Omega Semiconductor Inc.
709099L9PFI
100-LQFP
FinishAdapt Limited
CY7C136E-25NXC
52-BQFP
FinishAdapt Limited
CY7C131E-55NXI
52-BQFP
Alpha & Omega Semiconductor Inc.
70914S25PF
80-LQFP
EPCOS (TDK)
IS61LV25616AL-10BLI
48-TFBGA
BeagleBoard.org
D2732A-2
Anaren
MR2A08AYS35R
44-TSOP (0.400", 10.16mm Width)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
3247P1197-1
FinishAdapt Limited
CY15B108QI-20LPXIT
8-UQFN
FinishAdapt Limited
S25FL256SAGMFIR03
16-SOIC (0.295", 7.50mm Width)
FinishAdapt Limited
CY7C1471V33-133AXCT
100-LQFP
FinishAdapt Limited
CY7C131E-55JXCT
52-LCC (J-Lead)
EPCOS (TDK)
IS45S16320D-7CTLA2-TR
54-TSOP (0.400", 10.16mm Width)
BI Technologies
CAT24C32ZD2GI-T2
8-WDFN Exposed Pad
BI Technologies
CAT93C66YI-TE13
8-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
CY7C131E-25JXCT
52-LCC (J-Lead)
FinishAdapt Limited
S29GL128S10FHIV20
64-LBGA
EPCOS (TDK)
IS66WVH8M8ALL-166B1LI
24-TBGA
BI Technologies
CAT24C32ZD2GI
8-WDFN Exposed Pad
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT70P2388
FinishAdapt Limited
CY7C131E-55JXIT
52-LCC (J-Lead)
Alpha & Omega Semiconductor Inc.
70914S15J8
68-LCC (J-Lead)
Integrated Device Technology (IDT)
MX30LF4G28AD-XKI
63-VFBGA
EPCOS (TDK)
IS34ML01G084-BLI
63-VFBGA
Alpha & Omega Semiconductor Inc.
70914S15PF
80-LQFP
Alpha & Omega Semiconductor Inc.
70914S15PF8
80-LQFP