|
Part Number |
|
|
|
|
Details |
|
|
|
Samtec Inc. |
ADM706TARZ-REEL
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8211CPA+
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
ON SEMICONDUCTOR |
MC32PF3001A2EPR2
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Transphorm |
APX803L40-27SR-7
|
|
TO-236-3, SC-59, SOT-23-3 |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8211CSA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
LTC2906CDDB#TRPBF
|
|
8-WFDFN Exposed Pad |
|
|
|
|
Raltron Electronics |
MP2313GJ-P
|
|
SOT-23-8 Thin, TSOT-23-8 |
|
|
|
|
Transphorm |
APX810S05-46SA-7
|
|
TO-236-3, SC-59, SOT-23-3 |
|
|
|
|
Laird - Wireless & Thermal Systems |
IXDN630MCI
|
|
TO-220-5 |
|
|
|
|
IXYS Integrated Circuits Division |
DS1708ESA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Abracon LLC |
RT6276BHGQUF
|
|
12-UFQFN |
|
|
|
|
ON SEMICONDUCTOR |
MC32PF3001A4EPR2
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
TC4405CPA
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
ON SEMICONDUCTOR |
MPF5024AVNA0ESR2
|
|
40-VFQFN Exposed Pad |
|
|
|
|
Laird-Signal Integrity Products |
XC6127N44KMR-G
|
|
SC-74A, SOT-753 |
|
|
|
|
Laird-Signal Integrity Products |
XC6129C22D9R-G
|
|
4-XDFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
IR2233SPBF
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
MC32PF3001A5EPR2
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LTC2917IDDB-A1#TRPBF
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Laird-Signal Integrity Products |
XC6129C23D9R-G
|
|
4-XDFN Exposed Pad |
|
|
|
|
Laird-Signal Integrity Products |
XC6127N46KMR-G
|
|
SC-74A, SOT-753 |
|
|
|
|
Advanced Linear Devices Inc. |
O3852AQDCARQ1
|
|
48-TFSOP (0.240", 6.10mm Width) Exposed Pad |
|
|
|
|
Transphorm |
APX803L20-30SR-7
|
|
TO-236-3, SC-59, SOT-23-3 |
|
|
|
|
Advanced Linear Devices Inc. |
LM60440ARPKR
|
|
13-PowerWFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX6394US317D2+T
|
|
TO-253-4, TO-253AA |
|
|
|
|
ON SEMICONDUCTOR |
UJA1131HW/FD/3V/0Y
|
|
48-TQFP Exposed Pad |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM2576D2TR4-3.3G
|
|
TO-263-6, D²Pak (5 Leads + Tab), TO-263BA |
|
|
|
|
Abracon LLC |
RT2855ALGQW
|
|
16-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8212CPA+
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
ON SEMICONDUCTOR |
MC33FS4505NAER2
|
|
|
|
|
|
